Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and
About Tekion: Positively disrupting an industry that has not seen any innovation in over 50 years, Tekion has challenged the paradigm with the first and fastest cloud-native automotive platform that includes the revolutionary Automotive Retail Cloud
Title: GPIO Circuit Design Engineer About GlobalFoundries GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers
Tätigkeitsbereich:Forschung & Entwicklung incl. Design Fachabteilung:LCM - VAN/EF Gesellschaft:Mercedes-Benz Research and Development India Private Limited Standort:Mercedes-Benz Research and Development India Private Limited, Bangalore Startdatum:01.07.2026 Veröffentlichungsdatum:05.06.2026 Stellennummer:MER00043Y1 Arbeitszeit:Vollzeit Bewerben Aufgaben Education Graduate in Automobile/Mechanical/Production/Industrial Engineering No of years:
SummaryGuidewire’s Product Development and Operations (PDO) team is hiring a dynamic leader to run cloud-native, big-data services that power the Guidewire Data Platform (GDP). You’ll build high-performing teams, drive product outcomes, and champion a customer-first mindset
For over 20 years, Smartsheet has empowered teams to manage work seamlessly and scale solutions smarter. Now, in our most ambitious chapter yet, we are uniting human teams with AI agents. By orchestrating the work agents
At Alstom, we understand transport networks and what moves people. From high-speed trains, metros, monorails, and trams, to turnkey systems, services, infrastructure, signalling and digital mobility, we offer our diverse customers the broadest portfolio in the
Summary of Position: At Alcon, were passionate about enhancing sight and helping people see brilliantly. With more than 25,000 associates, we innovate fearlessly, champion progress, and act swiftly to impact global eye health. We foster an
At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivitys Signal Integrity Center of Excellence (SI COE) drives
At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivitys Signal Integrity Center of Excellence (SI COE) drives
About the role We are building EIQ, a platform product that enterprises use, among other things, to make their data governed, secured, controlled, discoverable, curated, processed, and delivered — across every stage of the data lifecycle.
Skillset: Domain Consultant – Pulp Packaging / Paper Industry / Food Manufacturing Experience: 12 – 20 Years Job Location: Mumbai, Delhi NCR, Bangalore, Chennai, Kolkata Job Description: At least 12+ years of Working Industry Experience or Consulting
Job Description We are seeking a highly skilled Senior Engineer, Packaging Engineering to join our team in Bengaluru, India. In this role, you will lead semiconductor packaging technology for flash memory products. Represents Package Engineering in cross-functional teams and ensures
Job Description Our Package Design Engineering team is seeking a talented Staff Engineer with expertise in thermal management, based at our Bangalore site. In this role, you will be pivotal in driving innovation in thermal design for
Company:Qualcomm India Private Limited Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: We are looking for a highly motivated packaging engineer capable of leading state-of-the-art advanced IC packaging development and new product introduction of leading-edge package technologies for AI, Mobile,
Company:Qualcomm India Private Limited Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of whats possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected
Company:Qualcomm India Private Limited Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of whats possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected
Company:Qualcomm India Private Limited Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of whats possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected