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Responsibilities: Product Positioning: Define and articulate unique selling propositions (USPs) for our wireless IC products, ensuring alignment with market demands and company goals. (30%) Business Execution: Drive opportunity funnel creation to achieve new product business plans,
RESPONSIBILITIES Technical Leadership & Strategy (40%) Define and own the end-to-end chip design strategy, methodology, and technology roadmap across all design verticals — SoC, Analog, Digital, Product & Test Engineering, Design Packaging, Verification and DFT. Establish
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