Job Description SummaryThe Packaging Design Engineer will be part of GE HealthCare’s global packaging organization and will lead end-to-end packaging engineering projects supporting multiple product modalities and business segments. Based at the GE BEL site in Bangalore, this individual contributor
Job Title- Senior Packaging Design Specialist Location- Netaji Subhash Place Experience- 4-6 years About MARS Cosmetics- MARS Cosmetics is a globally recognized beauty brand that thrives on innovation, diversity, and empowering individuals through high-quality beauty solutions. Headquartered in
Overview Automobile HVAC design Responsibilities Mandatory : ● 3D CAD design for plastic Injection molded parts using Catia V5 R24● Part design using constrained Sketches and Boolean operation with Inner / outer methodology● Working in Product structure using multi-Skeleton
Our Automotive Microcontroller R&D teamis looking for an experienced SoC HW Systems Engineer to join the Chip-LevelArchitecture team and own the package, ballout, and IO interface strategy forour next-generation automotive microcontroller platform. Your role Key responsibilities
About us For well over a century, ExxonMobil has been at the heart of creating and growing a modern world. We embrace the power and promise of technology, pushing the boundaries of whats possible. For billions
Requisition ID:21948 CityIndia-AES-Mag Group Overview: Headquartered in Riyadh, Saudi Arabia, we operate construction and manufacturing businesses, design & development centers and a host of facilities in the Middle East and other countries. alfanar is involved in: •
Job Description SummaryThe Packaging Regulation, Sustainability & PPWR Program Leader is a senior individual contributor within GE HealthCare’s global Packaging Engineering function, responsible for leading packaging initiatives across product portfolios and regions. The role combines packaging design engineering, regulatory compliance, packaging sustainability,
Position summary The Content Manager serves as the Construction, Building Products & Packaging subject matter expert within the Energy & Industrials pod and owns its expert research content coverage. The role identifies the companies, themes and investor
Tätigkeitsbereich:Forschung & Entwicklung incl. Design Fachabteilung:Exterior 2 Gesellschaft:Mercedes-Benz Research and Development India Private Limited Standort:Mercedes-Benz Research and Development India Private Limited, Pune Startdatum:01.10.2026 Veröffentlichungsdatum:24.08.2026 Stellennummer:MER00047LX Arbeitszeit:Vollzeit Bewerben Aufgaben 1) Manage new product development activities of HVAC hoses
Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of
Job Description: Senior/Lead Engineer – Product Packaging ROLES AND RESPONSIBILITIES: Candidate will be responsible for designing Primary / Secondary & Tertiary packaging for Existing / New products & their Accessories Develop new packaging systems and/or improve existing packaging systems to
Company Description Renesas is a global semiconductor leader shaping the backbone of next-generation automotive, industrial, cloud, and IoT innovation. With over $9.3 billion in annual revenue (2024) and a world-class team of 22,700+ employees, Renesas operates
Company:Qualcomm India Private Limited Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of whats possible to enable next-generation experiences and drives digital transformation to help create
Company:Qualcomm India Private Limited Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: BDC WRD (Wi-Fi) is responsible for developing Qualcomm’s Wi-Fi chips. We are looking for a digital design engineer, with some signal processing background. As
Company:Qualcomm India Private Limited Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of whats possible to enable next-generation experiences and drives digital transformation to help create
Company:Qualcomm India Private Limited Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of whats possible to enable next-generation experiences and drives digital transformation to help create
Company:Qualcomm India Private Limited Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of whats possible to enable next-generation experiences and drives digital transformation to help create
Company:Qualcomm India Private Limited Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: We are looking for a highly motivated packaging engineer capable of leading state-of-the-art advanced IC packaging development and new product introduction of leading-edge package technologies
Company:Qualcomm India Private Limited Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of whats possible to enable next-generation experiences and drives digital transformation to help create
Company:Qualcomm India Private Limited Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of whats possible to enable next-generation experiences and drives digital transformation to help create