Lead Electro Mechanical Packaging Design & Analysis Engineer Company: Boeing India Private Limited Job ID: 00000412029 Date Posted: 2024-02-07 Location: IND - Bangalore, India Job Description Qualifications: Job Title: Lead Electro Mechanical Packaging Design & Analysis
Description Need Strong Product design Experience in Mechanical Engineering and Manufacturing processes. Work with global teams to design sub systems / systems of process chambers used in semiconductor equipment industry using Semi standard. Key Responsibilities Problem
Job Description : Structural Design Aerospace + Airbus mandatory Experience with CATIA V5 on Aircraft structures and/or Airframe Design, Doors/Wings/HTP/VTP/Pylon and MSI. Legacy conversion of Primary and secondary structural components Using Catia V5 (Machined, Sheet metal, Extruded, Metallic &
Job Description :Mechanical engineer | 3 TO 8 Years| Bangalore Role and Responsibilities Minimum 3 years’ experience in Plastic product design and development using Creo. Experience in High Sensors, voltage connectors, Relays, Switches or Functional Plastic
Preferred Qualifications An M.E. / M. Tech / Dual Degree in Mechanical Engineering / Mechanical Design / Applied Mechanics / Manufacturing & Precision Engineering with minimum 65% aggregate Graduating in 2024 without any backlogs Job Responsibilities
Preferred Qualifications B.E. / B. Tech in Mechanical Engineering with minimum 65% aggregate Graduating in 2023 without any backlogs Job Responsibilities Your typical day: Design and Development of Mechanical components and sub-systems Analyze design through simulations and
Mechanical Engineer 1 Do you want to jumpstart your career in Product Development? Are you interested in helping develop the next generation of IC manufacturing machines? Are you excited about the application of Plasma Engineering, Radio
Mechanical Engineer 1 Do you want to jumpstart your career in Product Development? Are you interested in helping develop the next generation of IC manufacturing machines? Are you excited about the application of Plasma Engineering, Radio
You are: An M.E. / M. Tech / Dual Degree in Mechanical Engineering / Mechanical Design / Applied Mechanics / Manufacturing & Precision Engineering with minimum 65% aggregate Graduating in 2024 without any backlogs Your typical
Your Job Responsible for the design and development of I/O (input/output) external cable products. Manages new product creation & modifications through the complete implementation process to develop product that meet or exceed product performance per internal
Dover is a diversified global manufacturer with annual revenue of over $8 billion. We deliver innovative equipment and components, specialty systems, consumable supplies, software and digital solutions, and support services through five operating segments: Engineered Products, Clean
Dover is a diversified global manufacturer with annual revenue of over $8 billion. We deliver innovative equipment and components, specialty systems, consumable supplies, software and digital solutions, and support services through five operating segments: Engineered Products, Clean
Company Overview JB Poindexter (India) Private Limited is a subsidiary of J.B. Poindexter & Co., Inc. a privately held diversified manufacturing company forecasting $2.4B in annual revenue and 8,000 team members in 2024. The eight operating
Your Job Responsible for the design and development of DSS (Datacom & Specialty Solutions) products. Develops designs and manages product modifications that meet performance requirements as per Industry standards and customer specifications. Generates 3D CAD models,
Your Job Phillips-Medisize, India is seeking a Senior Mechanical Design Engineer to design and develop medical device and drug delivery products, following the Phillips-Medisize Design Development Process (DDP) and applicable standards such as ISO 13485 with
About Lam Research Lam Research is a leading global manufacturer of capital equipment used in making leading edge semiconductors across the world. We primarily compete in four specific areas deposition, etch, photoresist strip, and single wafer
Introduction: As a leading global supplier of wafer fabrication equipment and services to the semiconductor industry, Lam Research develops innovative solutions that help our customers build smaller, faster, and more power-efficient devices. We are a company
Introduction As a leading global supplier of wafer fabrication equipment and services to the semiconductor industry, Lam Research develops innovative solutions that help our customers build smaller, faster, and more power-efficient devices. We are a company
Lead Electro Mechanical Packaging Design & Analysis Engineer Company: Boeing India Private Limited Job ID: 00000418139 Date Posted: 2024-03-25 Location: IND - Bangalore, India Job Description Qualifications: Job Title: Lead Electro Mechanical Packaging Design & Analysis
Your Opportunity Need a Strong Mechanical Engineer for design and development of Semiconductor products. Roles and Responsibility Work with global teams to design sub systems / systems of process chambers used in semiconductor equipment industry. Develop,